Invention Grant
- Patent Title: Wire bonding apparatus threading system
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Application No.: US16697513Application Date: 2019-11-27
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Publication No.: US11239197B2Publication Date: 2022-02-01
- Inventor: Keng Yew Song , Yue Zhang , Xiao Liang Chen , Yao Tong
- Applicant: ASM Technology Singapore Pte Ltd
- Applicant Address: SG Singapore
- Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee: ASM Technology Singapore Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L23/00 ; B23K101/40

Abstract:
A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.
Public/Granted literature
- US20210159205A1 WIRE BONDING APPARATUS THREADING SYSTEM Public/Granted day:2021-05-27
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