Invention Grant
- Patent Title: Array substrate and fabrication method thereof, and electronic apparatus
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Application No.: US16631016Application Date: 2018-11-02
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Publication No.: US11239221B2Publication Date: 2022-02-01
- Inventor: Haixu Li
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Banner & Witcoff, Ltd.
- International Application: PCT/CN2018/113792 WO 20181102
- International Announcement: WO2020/087525 WO 20200507
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L27/12 ; H01L33/62

Abstract:
An array substrate and a fabrication method thereof, and an electronic apparatus are disclosed. The array substrate includes a base substrate, a thin film transistor, a first connection electrode and a first insulation layer. The thin film transistor is on the base substrate and including a first electrode and a second electrode; the first connection electrode in a layer different from the first electrode and electrically connected with the first electrode; and the first insulation layer covering at least a portion of the first connection electrode; an area of an orthographic projection of the first connection electrode on the base substrate is larger than an area of an orthographic projection of the first electrode on the base substrate, and the first insulation layer is made from an organic insulation material.
Public/Granted literature
- US20210066267A1 Array Substrate And Fabrication Method Thereof, And Electronic Apparatus Public/Granted day:2021-03-04
Information query
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