A semiconductor substrate includes a first main surface and a second main surface opposing each other. The semiconductor substrate includes a plurality of second semiconductor regions in a side of the second main surface. Each of the second semiconductor regions includes a first region including a textured surface, and a second region where a bump electrode is disposed. An insulating film includes a first insulating film covering surfaces of the second semiconductor regions, and a second insulating film covering peripheries of pad electrodes. The pad electrodes include a first electrode region in contact with the second region, and a second electrode region continuous with the first electrode region. The second electrode region is disposed on at least a part of a region included in the first insulating film and corresponding to the first region. The first main surface is a light incident surface of the semiconductor substrate.