Invention Grant
- Patent Title: Array substrate and method for manufacturing the same
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Application No.: US16538081Application Date: 2019-08-12
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Publication No.: US11239299B2Publication Date: 2022-02-01
- Inventor: Wenjun Hou
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Armstrong Teasdale LLP
- Priority: CN201910115716.9 20190215
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/00 ; H01L51/56 ; G03F7/038 ; G03F7/20 ; G03F7/26

Abstract:
The present disclosure relates to an array substrate and a method for manufacturing the same. The array substrate includes a substrate having first regions for forming pixels and second regions located between the first regions, light shielding portions located within portions of the second regions adjacent to the first regions on the substrate, and pixel defining portions located within the second regions. At least a side surface of the light shielding portion adjacent to the first region is not covered by the pixel defining portion.
Public/Granted literature
- US20200266258A1 ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-08-20
Information query
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