- Patent Title: Semiconductor device and semiconductor device manufacturing method
-
Application No.: US16799733Application Date: 2020-02-24
-
Publication No.: US11239324B2Publication Date: 2022-02-01
- Inventor: Takashi Yoshimura , Yuichi Onozawa , Hiroshi Takishita , Misaki Meguro , Motoyoshi Kubouchi , Naoko Kodama
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JPJP2018-051655 20180319
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/22 ; H01L21/265 ; H01L21/322 ; H01L29/06 ; H01L29/12 ; H01L29/739 ; H01L29/78 ; H01L29/861

Abstract:
Provided is a semiconductor device including a semiconductor substrate; a hydrogen donor that is provide inside the semiconductor substrate in a depth direction, has a doping concentration that is higher than a doping concentration of a dopant of the semiconductor substrate, has a doping concentration distribution peak at a first position that is a predetermined distance in the depth direction of the semiconductor substrate away from one main surface of the semiconductor substrate, and has a tail of the doping concentration distribution where the doping concentration is lower than at the peak, farther on the one main surface side than where the first position is located; and a crystalline defect region having a crystalline defect density center peak at a position shallower than the first position, in the depth direction of the semiconductor substrate.
Information query
IPC分类: