Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US16926766Application Date: 2020-07-12
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Publication No.: US11239354B2Publication Date: 2022-02-01
- Inventor: Chun-Chieh Lu , Chao-Ching Cheng , Tzu-Ang Chao , Lain-Jong Li
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/24 ; H01L29/417 ; H01L29/786 ; H01L21/02 ; H01L29/66

Abstract:
A transistor device having fin structures, source and drain terminals, channel layers and a gate structure is provided. The fin structures are disposed on a material layer. The fin structures are arranged in parallel and extending in a first direction. The source and drain terminals are disposed on the fin structures and the material layer and cover opposite ends of the fin structures. The channel layers are disposed respectively on the fin structures, and each channel layer extends between the source and drain terminals on the same fin structure. The gate structure is disposed on the channel layers and across the fin structures. The gate structure extends in a second direction perpendicular to the first direction. The materials of the channel layers include a transition metal and a chalcogenide, the source and drain terminals include a metallic material, and the channel layers are covalently bonded with the source and drain terminals.
Public/Granted literature
- US20210134992A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-05-06
Information query
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