Invention Grant
- Patent Title: Optoelectronic module package
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Application No.: US16056340Application Date: 2018-08-06
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Publication No.: US11239377B2Publication Date: 2022-02-01
- Inventor: Gerald Cois Byrd , Thomas Pierre Schrans , Chia-Te Chou , Arin Abed , Omar James Bchir
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB London
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB London
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L31/02 ; H01L23/532 ; H05K1/02 ; G02B6/42

Abstract:
An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
Public/Granted literature
- US20190044002A1 OPTOELECTRONIC MODULE PACKAGE Public/Granted day:2019-02-07
Information query
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