Invention Grant
- Patent Title: SPAD image sensor and associated fabricating method
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Application No.: US16833150Application Date: 2020-03-27
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Publication No.: US11239383B2Publication Date: 2022-02-01
- Inventor: Yuichiro Yamashita
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L31/107
- IPC: H01L31/107 ; H01L27/144 ; H01L31/0232 ; H01L27/146 ; H01L29/06 ; H01L31/02 ; H01L31/18

Abstract:
A single photon avalanche diode (SPAD) image sensor is disclosed. The SPAD image sensor includes: a substrate having a front surface and a back surface; wherein the substrate includes a sensing region, and the sensing region includes: a common node heavily doped with dopants of a first conductivity type, the common node being within the substrate and abutting the back surface of the substrate; a sensing node heavily doped with dopants of a second conductivity type opposite to the first conductivity type, the sensing node being within the substrate and abutting the front surface of the substrate; and a first layer doped with dopants of the first conductivity type between the common node and the sensing node.
Public/Granted literature
- US20200227582A1 SPAD IMAGE SENSOR AND ASSOCIATED FABRICATING METHOD Public/Granted day:2020-07-16
Information query
IPC分类: