A method and device for modifying a film deposition position in a film deposition process with a mask component are disclosed. The mask component includes a mask frame and a mask body fixed to the mask frame. The method includes obtaining a first offset displacement between a plurality of second mark points on the mask component and a plurality of first mark points on the mask body, obtaining a second offset displacement between the plurality of third mark points on the substrate and the plurality of second mark points on the mask component, determining an actual offset displacement between an actual forming position and a preset forming position of the film, according to the first offset displacement and the second offset displacement, and modifying the preset forming position of the film, according to the actual offset displacement between the actual forming position and the preset forming position of the film.