Embodiments of the present disclosure relate to a method for manufacturing a display panel. The method includes providing a hardness-variable material layer and a flexible layer on the hardness-variable material layer, and bonding a chip to the flexible layer. The hardness-variable material layer is set to be in a hard state before bonding the chip to the flexible layer. After bonding the chip to the flexible layer, the hardness-variable material layer is peeled off. The hardness-variable material layer is set to be in a flexible state before peeling off the hardness-variable material layer.