Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17016390Application Date: 2020-09-10
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Publication No.: US11239868B2Publication Date: 2022-02-01
- Inventor: Takayuki Shinozaki , Yukiya Yamaguchi , Morio Takeuchi , Yoichi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-171568 20190920,JPJP2020-057911 20200327
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F3/195
Abstract:
A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.
Public/Granted literature
- US20210091801A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-03-25
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