A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.