- Patent Title: Method for producing a printed circuit board-cooling body structure
-
Application No.: US16895784Application Date: 2020-06-08
-
Publication No.: US11240905B2Publication Date: 2022-02-01
- Inventor: Dirk Boesch , Frank Brinkmeier , Markus Goesling , Christian Koerdt , Werner Koesters , Frank Muenzner , Sebastian Nordhoff , Marc Schlueter , Thomas Wiese
- Applicant: HELLA GMBH & CO. KGAA
- Applicant Address: DE Lippstadt
- Assignee: HELLA GMBH & CO. KGAA
- Current Assignee: HELLA GMBH & CO. KGAA
- Current Assignee Address: DE Lippstadt
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: DE102017129311.6 20171208
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/02 ; F21S45/49 ; F21S45/47 ; H05K3/30 ; H05K3/46
Abstract:
The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.
Public/Granted literature
Information query
