Invention Grant
- Patent Title: Carrier tape system and components and methods of use
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Application No.: US16291380Application Date: 2019-03-04
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Publication No.: US11240947B2Publication Date: 2022-02-01
- Inventor: Sung-Sheng Chiu , Pei-Haw Tsao , Tsui-Mei Chen , Shih-Hsing Lin , Li-Huan Chu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H01L21/683 ; H05K13/00 ; H05K13/04 ; B65B9/04 ; H01L21/673
Abstract:
The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
Public/Granted literature
- US20200008330A1 CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE Public/Granted day:2020-01-02
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