Invention Grant
- Patent Title: Feedthrough terminal assembly with an electrically conductive pad conductively connected to a terminal pin
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Application No.: US16435600Application Date: 2019-06-10
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Publication No.: US11241581B2Publication Date: 2022-02-08
- Inventor: Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel
- Applicant: Greatbatch Ltd.
- Applicant Address: US NY Clarence
- Assignee: Greatbatch Ltd.
- Current Assignee: Greatbatch Ltd.
- Current Assignee Address: US NY Clarence
- Agent Michael F. Scalise
- Main IPC: A61N1/08
- IPC: A61N1/08 ; A61N1/375 ; A61N1/37 ; H05K1/18 ; H05K9/00 ; H01G4/35 ; H03H1/00 ; H01G4/40 ; H01G4/06 ; H05K5/00 ; H03H7/01 ; H01R13/7195
Abstract:
A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.
Public/Granted literature
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