Invention Grant
- Patent Title: Sound absorption/insulation honeycomb panel
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Application No.: US16614340Application Date: 2019-06-26
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Publication No.: US11241873B2Publication Date: 2022-02-08
- Inventor: Koichi Take , Tomohisa Nakamura , Daisuke Iwasaki , Takuma Nemoto
- Applicant: SHIZUKA CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: SHIZUKA CO., LTD.
- Current Assignee: SHIZUKA CO., LTD.
- Current Assignee Address: JP Atsugi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JPJP2018-210130 20181108,JPJP2019-070929 20190402
- International Application: PCT/JP2019/025329 WO 20190626
- International Announcement: WO2020/095475 WO 20200514
- Main IPC: B32B3/00
- IPC: B32B3/00 ; B32B5/00 ; B32B7/00 ; B32B37/00 ; E04B1/00 ; E04C2/00 ; G10K11/00 ; B32B37/12 ; B32B5/18 ; B32B7/14 ; B32B5/02 ; B32B5/24 ; B32B37/14 ; E04B1/86 ; E04C2/36 ; G10K11/168 ; B32B3/12 ; E04B1/74

Abstract:
For forming a sound absorption/insulation honeycomb panel by stacking an air-permeable material, a honeycomb material filled with a sound absorption material and a reflector, and adhesively joining these materials, it is hard to join the honeycomb material and the air-permeable material adhesively due to a thin wall surface of the honeycomb material and a resultant line to surface adhesive joint therebetween, causing a problem of low adhesive strength. By using a water absorption honeycomb material, an adhesive joint is formed with an adhesive joint area increased by dipping an end of a wall surface of a cell forming the water absorption honeycomb material into a water-soluble adhesive, making the end flexible over a fixed period of time, and then pressing the end strongly against an air-permeable material as a counterpart of the adhesive joint to deform a tip into an inverted T-shape.
Public/Granted literature
- US20210331457A1 SOUND ABSORPTION/INSULATION HONEYCOMB PANEL Public/Granted day:2021-10-28
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