Invention Grant
- Patent Title: Layout structure of refrigerant piping near heat accumulator in vehicle
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Application No.: US17143169Application Date: 2021-01-07
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Publication No.: US11241933B2Publication Date: 2022-02-08
- Inventor: Masaki Nagakura , Hajime Uto , Masanobu Takazawa
- Applicant: Honda Motor Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2020-001486 20200108
- Main IPC: B60H1/00
- IPC: B60H1/00

Abstract:
Provided is a layout structure of refrigerant piping near a heat accumulator in a vehicle, which is connected to the heat accumulator and can reduce cooling of the refrigerant piping near the heat accumulator due to blowing of wind that comes with running of the vehicle, thereby suppressing heat dissipation of the refrigerant flowing into and out of the heat accumulator. The heat accumulator mounted in a front portion of the vehicle is arranged to extend in a direction substantially orthogonal to a front-rear direction of the vehicle, and has refrigerant inflow part and outflow part at an end. The refrigerant piping includes inflow piping connected to the inflow part and outflow piping connected to the outflow part. The inflow piping and outflow piping are arranged to extend along a length direction of the heat accumulator in a state of being close to a back surface of the heat accumulator.
Public/Granted literature
- US20210206228A1 LAYOUT STRUCTURE OF REFRIGERANT PIPING NEAR HEAT ACCUMULATOR IN VEHICLE Public/Granted day:2021-07-08
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