Invention Grant
- Patent Title: Packing body, method of manufacturing packing body, and method of manufacturing liquid ejecting apparatus
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Application No.: US16394840Application Date: 2019-04-25
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Publication No.: US11242186B2Publication Date: 2022-02-08
- Inventor: Yoshinori Nakajima , Shinichi Tokunaga , Takahiro Kanegae
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2018-083716 20180425
- Main IPC: B65D81/26
- IPC: B65D81/26 ; B41J2/175
Abstract:
There are included a packing material that has a moisture-proof property and forms a third space, a liquid ejecting head that includes a case member which forms a second space communicating with the third space, and a first moisture absorbing material and a piezoelectric element which are disposed in the second space, and is disposed in the third space, and a second moisture absorbing material that has a higher moisture absorbing property than that of the first moisture absorbing material and is disposed in the third space.
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