Invention Grant
- Patent Title: Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
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Application No.: US17050671Application Date: 2019-04-22
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Publication No.: US11242425B2Publication Date: 2022-02-08
- Inventor: Mikio Sato , Hiroaki Fujiwara , Yuki Kitai , Masashi Koda , Yasunori Hoshino , Takayoshi Ozeki
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-087155 20180427,JPJP2018-136061 20180719,JPJP2019-045680 20190313
- International Application: PCT/JP2019/016952 WO 20190422
- International Announcement: WO2019/208471 WO 20191031
- Main IPC: C08F290/06
- IPC: C08F290/06 ; C08J5/24 ; B32B15/08 ; B32B27/28 ; H05K1/03

Abstract:
A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
Public/Granted literature
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