Invention Grant
- Patent Title: Conductive composition and conductive molded article
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Application No.: US15121076Application Date: 2015-02-12
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Publication No.: US11242471B2Publication Date: 2022-02-08
- Inventor: Taisuke Iseda , Masahiro Iwamoto
- Applicant: Mitsuboshi Belting Ltd.
- Applicant Address: JP Kobe
- Assignee: Mitsuboshi Belting Ltd.
- Current Assignee: Mitsuboshi Belting Ltd.
- Current Assignee Address: JP Kobe
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2014-032895 20140224,JPJP2015-021464 20150205
- International Application: PCT/JP2015/053877 WO 20150212
- International Announcement: WO2015/125692 WO 20150827
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C08L63/00 ; C08L101/12 ; C08K3/08 ; C08G59/24 ; C08G59/50 ; C09J163/00 ; H01B1/22 ; C09J9/00 ; C09J11/04 ; C09K5/14
Abstract:
The present invention relates to a conductive composition containing a conductive metal powder and a resin component, in which the conductive metal powder contains at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape, and the resin component contains an aromatic amine skeleton.
Public/Granted literature
- US20160362585A1 Conductive Composition and Conductive Molded Article Public/Granted day:2016-12-15
Information query
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