Invention Grant
- Patent Title: Adhesive film
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Application No.: US16486522Application Date: 2018-02-14
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Publication No.: US11242472B2Publication Date: 2022-02-08
- Inventor: Tetsuyuki Shirakawa , Hiroyuki Izawa , Takahiro Fukui , Tatsuya Kumada
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2017-027983 20170217,JPJP2017-027985 20170217
- International Application: PCT/JP2018/005012 WO 20180214
- International Announcement: WO2018/151131 WO 20180823
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C08K3/08 ; C09J11/04 ; C09J201/00

Abstract:
One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.
Information query
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