Invention Grant
- Patent Title: Adhesive resin composition and laminate
-
Application No.: US16052615Application Date: 2018-08-02
-
Publication No.: US11242475B2Publication Date: 2022-02-08
- Inventor: Hirokazu Iizuka , Kunihiro Takei , Jun Suzuki
- Applicant: FUJIMORI KOGYO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIMORI KOGYO CO., LTD.
- Current Assignee: FUJIMORI KOGYO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: JPJP2017-160386 20170823
- Main IPC: C09J123/26
- IPC: C09J123/26 ; C09J151/06

Abstract:
Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).
Public/Granted literature
- US20190062604A1 ADHESIVE RESIN COMPOSITION AND LAMINATE Public/Granted day:2019-02-28
Information query
IPC分类: