Invention Grant
- Patent Title: High temperature face plate for deposition application
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Application No.: US16904169Application Date: 2020-06-17
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Publication No.: US11242600B2Publication Date: 2022-02-08
- Inventor: Amit Kumar Bansal , Saket Rathi , Tuan Anh Nguyen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/40
- IPC: C23C16/40 ; C23C16/455

Abstract:
Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed in the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.
Public/Granted literature
- US20210395881A1 HIGH TEMPERATURE FACE PLATE FOR DEPOSITION APPLICATION Public/Granted day:2021-12-23
Information query
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