Invention Grant
- Patent Title: Silicon carbide substrate and method of manufacturing the same
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Application No.: US14978866Application Date: 2015-12-22
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Publication No.: US11242618B2Publication Date: 2022-02-08
- Inventor: Shin Harada , Shinsuke Fujiwara , Taro Nishiguchi
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2011-205513 20110921
- Main IPC: C30B23/02
- IPC: C30B23/02 ; C30B35/00 ; H01L21/02 ; C30B23/00 ; C30B29/36

Abstract:
A silicon carbide substrate capable of stably forming a device of excellent performance, and a method of manufacturing the same are provided. A silicon carbide substrate is made of a single crystal of silicon carbide, and has a width of not less than 100 mm, a micropipe density of not more than 7 cm−2, a threading screw dislocation density of not more than 1×104 cm−2, a threading edge dislocation density of not more than 1×104 cm−2, a basal plane dislocation density of not more than 1×104 cm−2, a stacking fault density of not more than 0.1 cm−1, a conductive impurity concentration of not less than 1×1018 cm−3, a residual impurity concentration of not more than 1×1016 cm−3, and a secondary phase inclusion density of not more than 1 cm−3.
Public/Granted literature
- US20160108553A1 SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-04-21
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