Invention Grant
- Patent Title: Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same
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Application No.: US17097033Application Date: 2020-11-13
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Publication No.: US11242619B2Publication Date: 2022-02-08
- Inventor: Chih-Hung Bai , Yao-Tsung Chen , Zong-Cyuan Chen , Shih-Chun Chung
- Applicant: CHEMLEADER CORPORATION
- Applicant Address: TW Hsinchu County
- Assignee: CHEMLEADER CORPORATION
- Current Assignee: CHEMLEADER CORPORATION
- Current Assignee Address: TW Hsinchu County
- Agency: Bacon & Thomas, PLLC
- Priority: TW108144788 20191206
- Main IPC: B32B15/00
- IPC: B32B15/00 ; C30B29/60 ; C30B29/10 ; C30B7/12 ; C25D5/00 ; C25D3/38 ; H01L23/498 ; H05K1/09 ; H01B5/14

Abstract:
A nano-twinned copper layer is disclosed, wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°. In addition, a method for manufacturing the nano-twinned copper layer and a substrate comprising the same are also disclosed.
Public/Granted literature
- US20210172086A1 NANO-TWINNED COPPER LAYER, METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE COMPRISING THE SAME Public/Granted day:2021-06-10
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