Invention Grant
- Patent Title: Electrical measurable overlay structure
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Application No.: US16597357Application Date: 2019-10-09
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Publication No.: US11243063B2Publication Date: 2022-02-08
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Alexander G. Jochym
- Main IPC: G01B7/14
- IPC: G01B7/14 ; H01L23/00 ; H03K3/037

Abstract:
The wafer comprises a first line in a first layer of the wafer. The first line has a first terminal connected to the first line. The wafer comprises a second line in the first layer of the wafer. The second line has a second terminal connected to the second line. The second terminal has a probe connected to apply a voltage ramp. The wafer comprises a third line in the first layer of the wafer. The third line has a terminal connected to the third line.
Public/Granted literature
- US20210108908A1 ELECTRICAL MEASURABLE OVERLAY STRUCTURE Public/Granted day:2021-04-15
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