Invention Grant
- Patent Title: Heat flux measurement system
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Application No.: US16766540Application Date: 2018-11-28
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Publication No.: US11243124B2Publication Date: 2022-02-08
- Inventor: Atsushi Moriwaki , Ryo Yoshino , Hiroshi Makigano , Koichi Tanimoto
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-231032 20171130
- International Application: PCT/JP2018/043784 WO 20181128
- International Announcement: WO2019/107410 WO 20190606
- Main IPC: G01K17/00
- IPC: G01K17/00 ; G01K7/00 ; G01K3/00 ; G01K17/08 ; G01N25/18 ; G01N25/20

Abstract:
A heat flux measurement system includes a first wire, a first heat flux sensor singly provided in the middle of the first wire, a second wire including a first end connected to the first wire at a position closer to a first end of the first wire than the first heat flux sensor in which the second wire is formed of the same material as that of the first wire, a second heat flux sensor singly provided in the middle of the second wire, a first detection unit detecting a voltage between opposite ends of the first wire, and a second detection unit detecting a voltage between the first end of the first wire and a second end of the second wire.
Public/Granted literature
- US20200378843A1 HEAT FLUX MEASUREMENT SYSTEM Public/Granted day:2020-12-03
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