Invention Grant
- Patent Title: Composite sensor and manufacturing method thereof
-
Application No.: US16790784Application Date: 2020-02-14
-
Publication No.: US11243226B2Publication Date: 2022-02-08
- Inventor: Senlin Li
- Applicant: AUTOCHIPS WUHAN CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: AUTOCHIPS WUHAN CO., LTD.
- Current Assignee: AUTOCHIPS WUHAN CO., LTD.
- Current Assignee Address: CN Wuhan
- Priority: CN201910272024.5 20190404
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P1/02 ; G01L9/00 ; G01P15/12 ; G01L19/00 ; G01L27/00 ; G01P15/08

Abstract:
The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.
Public/Granted literature
- US20200319228A1 COMPOSITE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-10-08
Information query
IPC分类: