Invention Grant
- Patent Title: Vertical probe card
-
Application No.: US16695187Application Date: 2019-11-26
-
Publication No.: US11243231B2Publication Date: 2022-02-08
- Inventor: Tien-Chien Cheng
- Applicant: Tien-Chien Cheng
- Applicant Address: TW HsinChu
- Assignee: Tien-Chien Cheng
- Current Assignee: Tien-Chien Cheng
- Current Assignee Address: TW HsinChu
- Agency: Lanway IPR Services
- Agent Chun-Ming Shih
- Main IPC: G01R1/073
- IPC: G01R1/073 ; H01L21/48 ; H01L21/56 ; H01L21/768 ; H01L23/31 ; H01L23/373 ; H01L23/40 ; H01L23/473 ; H01L23/00 ; H01L21/304

Abstract:
A probe card includes a circuit board and a probe set. The probe set is electrically coupled to the circuit board. Also, the probe set includes a plurality of probes. Each of the plurality of probes includes a plurality of nanotwinned copper pillars that are arranged in a predetermined crystal orientation. In addition, each of the plurality of probes further includes a tip. The tip substantially and electrically contacts a chip. Such that the circuit board can test the chip via the tip.
Information query