- Patent Title: Testing an array of integrated circuits formed on a substrate sheet
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Application No.: US16483190Application Date: 2017-12-19
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Publication No.: US11243250B2Publication Date: 2022-02-08
- Inventor: James Edward Myers , John Philip Biggs , Jedrzej Kufel
- Applicant: ARM LIMITED
- Applicant Address: GB Cambridge
- Assignee: ARM LIMITED
- Current Assignee: ARM LIMITED
- Current Assignee Address: GB Cambridge
- Agency: Nixon & Vanderhye P.C.
- Priority: GB1701917 20170206
- International Application: PCT/GB2017/053806 WO 20171219
- International Announcement: WO2018/142094 WO 20180809
- Main IPC: G01R31/317
- IPC: G01R31/317 ; G01R31/3183 ; H01L21/66 ; H01L25/00

Abstract:
Integrated circuits (12) are manufactured by printing an array of circuit elements CE each containing an integrated circuit and associated testing circuitry (14). A plurality of integrated circuits within the array are tested in parallel to generate a corresponding plurality of individual test result signals. These individual test result signals are combined to form a combined test result signal indicating whether any of the plurality of integrated circuits tested in parallel operated incorrectly during their testing. If the combined test result signal indicates any faulty integrated circuits, then the entire plurality of integrated circuits (e.g. an entire row or column) may be discarded. The array of tested integrated circuits are then separated into discrete integrated circuits and are also separated from their testing circuit. Contacts (16, 18, 20) providing power signals, clock signals, and the reading of the combined test result signals are located at the periphery of a substrate sheet onto which the array of circuit elements are printed.
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