Methods and systems for testing bonding of a sensor assembly
Abstract:
A lidar sensor assembly includes a detector array having a plurality of photodetectors. An integrated circuit is bonded to the detector array via a plurality of connection bumps. A reference trace is defined by conductive material on at least one of the integrated circuit and the detector array. A test trace is defined by conductive material on the detector array, at least two of the connection bumps, and conductive material on the integrated circuit. A resistance measuring device is configured to independently measure a reference resistance along the reference trace and a test resistance along the test trace. The assembly also includes a processor in communication with the resistance measuring device. The processor is configured to receive the reference resistance and the test resistance, subtract the reference resistance from the test resistance to produce a bond resistance, and compare the bond resistance to a predetermined resistance value.
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