A joint layout is provided for the firm bonding of components by means of a light-activated joining agent. A light guide element is arranged at least in sections in a joint gap between the components. The light guide element is embedded into the joining agent in the joint gap, and light for activating the joining agent can be outcoupled from the light guide element in the joint gap. In this context, at least one spacer is arranged in the joint gap between the light guide element and at least one of the components.