Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16328804Application Date: 2017-04-03
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Publication No.: US11243469B2Publication Date: 2022-02-08
- Inventor: Masahiko Harumoto , Koji Kaneyama , Yuji Tanaka , Masaya Asai
- Applicant: SCREEN HOLDINGS CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: SCREEN HOLDINGS CO., LTD.
- Current Assignee: SCREEN HOLDINGS CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2016-180855 20160915
- International Application: PCT/JP2017/013879 WO 20170403
- International Announcement: WO2018/051563 WO 20180322
- Main IPC: G03F7/40
- IPC: G03F7/40 ; G03F7/32 ; H01L21/027 ; H01L21/687 ; H01L21/67
Abstract:
A substrate processing apparatus includes a development processor and a reversal film former, and processes a substrate having one surface on which a resist film made of a photosensitive material is formed. The development processor forms a resist pattern on the one surface of the substrate by performing development processing on a resist film using a development liquid. A reversal film former forms a reversal film having etch resistance higher than that of the resist film on the one surface of the substrate to cover the resist pattern while regulating a temperature of the substrate in a certain range after the development processing is performed by the development processor.
Public/Granted literature
- US20190196335A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2019-06-27
Information query
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