Invention Grant
- Patent Title: System and method for thermal management of reticle in semiconductor manufacturing
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Application No.: US16845077Application Date: 2020-04-10
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Publication No.: US11243478B2Publication Date: 2022-02-08
- Inventor: Yueh-Lin Yang , Chi-Hung Liao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method for thermal management of reticles for conducting an exposure process includes operations. A default state of a reticle is selected based on given data, where the given data includes overlay values of a plurality of processed semiconductor workpieces and temperature profiles of the reticle correlated to the processed semiconductor workpieces. The reticle is regulated to reach the default state before using the reticle to perform the exposure process.
Public/Granted literature
- US20210033987A1 SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF RETICLE IN SEMICONDUCTOR MANUFACTURING Public/Granted day:2021-02-04
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