Invention Grant
- Patent Title: Electronic device including foldable conductive plate
-
Application No.: US16910665Application Date: 2020-06-24
-
Publication No.: US11243564B2Publication Date: 2022-02-08
- Inventor: Seonghoon Kim , Harksang Kim , Sungho Ahn , Donghyun Yeom , Chungkeun Yoo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2019-0027753 20190311,KR10-2019-0070106 20190613
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
According to various embodiments, an electronic device may include a housing including an opening connected to an internal space, a tray socket disposed to be connected to the outside through the opening in the internal space and including a tray reception space, a tray inserted into the tray reception space, wherein the tray includes a tray body including at least one space configured to receive at least one external component, and a tray cover including a pin insertion hole configured to guide a tray ejecting pin to the opening, an eject bar movably disposed in a tray mounting direction or ejecting direction in the tray reception space and facing the pin insertion hole, and a rotation lever configured to press the tray in the ejection direction according to pressing of the eject bar in the tray reception space, wherein the eject bar is disposed at a position at least partially overlapped with the tray body when viewed from above the tray socket.
Public/Granted literature
- US20200319672A1 ELECTRONIC DEVICE INCLUDING FOLDABLE CONDUCTIVE PLATE Public/Granted day:2020-10-08
Information query