Invention Grant
- Patent Title: Foldable electronic device having dustproof structure
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Application No.: US17072772Application Date: 2020-10-16
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Publication No.: US11243566B2Publication Date: 2022-02-08
- Inventor: Heecheul Moon , Kwonho Son
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR10-2019-0130254 20191018
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An electronic device includes: a first housing, a second housing, a display, at least a portion of which is disposed on the first housing and the second housing, a hinge disposed between the first housing and the second housing and overlapping the first housing and the second housing, the first housing and the second housing configured to be folded or unfolded based on a folding operation or an unfolding operation of the hinge, and a fiber structure including at least one fiber disposed in a portion where the first housing or the second housing and the hinge overlap each other. The hinge includes a multi-joint arrangement bendable in a specified curve form, a first sliding part coupled to one side of the multi joint arrangement and configured to move inside or outside the first housing based on a folding or unfolding operation of the multi-joint arrangement, and a second sliding part coupled to another side of the multi-joint structure and configured to move inside or outside the second housing based on the folding or unfolding operation of the multi joint arrangement. The fiber structure includes a fiber part including at least one fiber, at least a portion of which contacts the first sliding part or the second sliding part, the fiber part configured to be deformed based on a movement of the first sliding part or the second sliding part, and a base that fixes the fiber part.
Public/Granted literature
- US20210116963A1 FOLDABLE ELECTRONIC DEVICE HAVING DUSTPROOF STRUCTURE Public/Granted day:2021-04-22
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