Invention Grant
- Patent Title: Handling pipeline submissions across many compute units
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Application No.: US17197126Application Date: 2021-03-10
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Publication No.: US11244420B2Publication Date: 2022-02-08
- Inventor: Balaji Vembu , Altug Koker , Joydeep Ray
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: G06T1/20
- IPC: G06T1/20 ; G06T15/00

Abstract:
One embodiment provides an apparatus comprising an interconnect fabric comprising one or more fabric switches, a plurality of memory interfaces coupled to the interconnect fabric to provide access to a plurality of memory devices, an input/output (IO) interface coupled to the interconnect fabric to provide access to IO devices, an array of multiprocessors coupled to the interconnect fabric, scheduling circuitry to distribute a plurality of thread groups across the array of multiprocessors, each thread group comprising a plurality of threads and each thread comprising a plurality of instructions to be executed by at least one of the multiprocessors, and a first multiprocessor of the array of multiprocessors to be assigned to process a first thread group comprising a first plurality of threads, the first multiprocessor comprising a plurality of parallel execution circuits.
Public/Granted literature
- US20210192676A1 HANDLING PIPELINE SUBMISSIONS ACROSS MANY COMPUTE UNITS Public/Granted day:2021-06-24
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