Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium
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Application No.: US16468383Application Date: 2017-11-30
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Publication No.: US11244820B2Publication Date: 2022-02-08
- Inventor: Yoichi Tokunaga
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2016-240142 20161212
- International Application: PCT/JP2017/043147 WO 20171130
- International Announcement: WO2018/110301 WO 20180621
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/04 ; B08B3/08 ; H01L21/67 ; H01L21/687 ; H01L21/66
Abstract:
There is provided a substrate processing apparatus including: a rotatable holding part configured to rotate a substrate while holding the substrate; a liquid supply part configured to supply a processing liquid to a peripheral edge portion of the substrate held by the rotatable holding part; a sensor configured to detect a temperature distribution at the peripheral edge portion; and a controller configured to execute an operation of detecting a boundary portion between a region of the peripheral edge portion to which the processing liquid adheres and a region of the peripheral edge portion to which the processing liquid does not adhere, based on the temperature distribution.
Public/Granted literature
- US20210257210A1 Substrate Processing Apparatus, Substrate Processing Method, and Storage Medium Public/Granted day:2021-08-19
Information query
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