Invention Grant
- Patent Title: Process gas supply apparatus and wafer treatment system including the same
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Application No.: US16902771Application Date: 2020-06-16
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Publication No.: US11244837B2Publication Date: 2022-02-08
- Inventor: Ki Yung Lee , Seung Bae Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: RatnerPrestia
- Priority: KR10-2019-0073591 20190620
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306 ; B01J4/00
Abstract:
Provided are a process gas supply apparatus which supplies a process gas onto a wafer to etch an oxide layer by dividing an edge zone into a first zone and a second zone located outside the first zone and dividing the second zone into a plurality of sub-zones and a wafer treatment system including the process gas supply apparatus.
Information query
IPC分类:
