An IC device includes a simultaneously formed capacitor and resistor structure. The capacitor and resistor may be located between a Back End of the Line (BEOL) interconnect stack and an external device interconnect pad of the IC device. The resistor may be used to step down a voltage applied across the resistor. The resistor may include one or more resistor plates that are formed simultaneously with a respective one or more plates of the capacitor. For example, a capacitor plate and a resistor plate may be patterned and formed from the same conductive sheet. Each of the resistor plates may be connected to one or more vertical interconnect accesses (VIA).