Invention Grant
- Patent Title: Substrate bonding structure and substrate bonding method
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Application No.: US16763666Application Date: 2018-03-16
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Publication No.: US11244874B2Publication Date: 2022-02-08
- Inventor: Koichiro Nishizawa
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2018/010522 WO 20180316
- International Announcement: WO2019/176095 WO 20190919
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/04 ; H01L23/10 ; H01L23/00 ; H05K3/36
Abstract:
A device (2) is formed on a main surface of a substrate (1). The main surface of the substrate (1) is bonded to the undersurface of the counter substrate (14) via the bonding member (11,12,13) in a hollow state. A circuit (17) and a bump structure (26) are formed on the top surface of the counter substrate (14). The bump structure (26) is positioned in a region corresponding to at least the bonding member (11,12,13), and has a higher height than that of the circuit (17).
Information query
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