Invention Grant
- Patent Title: Sealing structure and manufacturing method thereof
-
Application No.: US16088263Application Date: 2016-04-04
-
Publication No.: US11244877B2Publication Date: 2022-02-08
- Inventor: Tetsuya Nakatsuka , Shinya Kawakita , Susumu Ishida , Isamu Yoshida , Osamu Ikeda
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- International Application: PCT/JP2016/061024 WO 20160404
- International Announcement: WO2017/175274 WO 20171012
- Main IPC: H01L23/24
- IPC: H01L23/24 ; H01L21/54 ; H01L23/42 ; B29C45/14 ; H01L23/31 ; B29K67/00 ; B29K705/02 ; B29L31/34
Abstract:
Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.
Public/Granted literature
- US20200303272A1 Sealing Structure and Manufacturing Method Thereof Public/Granted day:2020-09-24
Information query
IPC分类:
