- Patent Title: Package cooled with cooling fluid and comprising shielding layer
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Application No.: US15710852Application Date: 2017-09-21
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Publication No.: US11244886B2Publication Date: 2022-02-08
- Inventor: Andreas Grassmann , Wolfram Hable , Juergen Hoegerl , Ivan Nikitin , Achim Strass
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016117843.8 20160921
- Main IPC: H01L23/42
- IPC: H01L23/42 ; H01L23/495 ; H01L23/552 ; H01L23/373 ; H01L23/473 ; H01L23/00 ; H01L23/31
Abstract:
A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.
Public/Granted literature
- US20180082925A1 Package cooled with cooling fluid and comprising shielding layer Public/Granted day:2018-03-22
Information query
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