Invention Grant
- Patent Title: Micro-LED display panel with stress releasing structure and method for fabricating the same
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Application No.: US16682395Application Date: 2019-11-13
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Publication No.: US11244966B2Publication Date: 2022-02-08
- Inventor: Haixu Li , Zhanfeng Cao , Ke Wang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Arent Fox LLP
- Agent Michael Fainberg
- Priority: CN201910043017.8 20190117
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L25/075

Abstract:
A micro LED display panel and a method for fabricating the same are disclosed, and the micro LED display panel includes a TFT back panel, and a micro LED fixed on the TFT back panel, wherein the TFT back panel includes a substrate, and a first insulation layer and a second insulation layer stacked over the substrate in that order, wherein the first insulation layer includes a groove filled with the second insulation layer, and a normal projection of the groove onto the substrate does not overlap with a normal projection of a TFT area in the TFT back panel onto the substrate, wherein the rigidity of the second insulation layer is lower than the rigidity of the first insulation layer.
Public/Granted literature
- US20200235127A1 MICRO-LED DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-07-23
Information query
IPC分类: