Invention Grant
- Patent Title: Method for attaching light transmissive member to light emitting element
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Application No.: US16878241Application Date: 2020-05-19
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Publication No.: US11245057B2Publication Date: 2022-02-08
- Inventor: Rie Maeda
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JPJP2017-146627 20170728
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/54 ; H01L33/60 ; H01L33/62 ; H01L33/00 ; H01L25/075

Abstract:
The method of manufacturing a light emitting device includes: providing a light-transmissive member; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces face an upper surface of the base member; disposing a generally flat layer of a light-transmissive bonding member on an upper surface of the light-transmissive member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces face the upper surface of the light-transmissive member via the bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member.
Public/Granted literature
- US20200279981A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2020-09-03
Information query
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