Invention Grant
- Patent Title: Packaging cover plate, organic light-emitting diode display and manufacturing method therefor
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Application No.: US16319576Application Date: 2018-05-11
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Publication No.: US11245099B2Publication Date: 2022-02-08
- Inventor: Linlin Wang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Arent Fox LLP
- Agent Michael Fainberg
- Priority: CN201710493209.X 20170626
- International Application: PCT/CN2018/086604 WO 20180511
- International Announcement: WO2019/001151 WO 20190103
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L21/54 ; H01L23/20 ; H01L23/22 ; H01L23/26 ; H01L21/56

Abstract:
Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.
Public/Granted literature
- US20210249632A1 PACKAGING COVER PLATE, ORGANIC LIGHT-EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREFOR Public/Granted day:2021-08-12
Information query
IPC分类: