Invention Grant
- Patent Title: Stack structure of printed circuit boards using interposer and electronic device including the same
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Application No.: US16789575Application Date: 2020-02-13
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Publication No.: US11245207B2Publication Date: 2022-02-08
- Inventor: Jungsik Park , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Woongeun Kwak
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2019-0019131 20190219
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R12/52 ; H05K1/11

Abstract:
An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.
Public/Granted literature
- US20200266562A1 STACK STRUCTURE OF PRINTED CIRCUIT BOARDS USING INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-08-20
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