Invention Grant
- Patent Title: Semiconductor laser
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Application No.: US16959528Application Date: 2018-10-19
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Publication No.: US11245248B2Publication Date: 2022-02-08
- Inventor: Shinya Satou , Hideto Iki
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2018-002115 20180110
- International Application: PCT/JP2018/038975 WO 20181019
- International Announcement: WO2019/138635 WO 20190718
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/16 ; H01S5/026 ; H01S5/10 ; H01S5/22 ; H01S5/20

Abstract:
A semiconductor laser includes a semiconductor layer including end faces and at least one of the end faces is configured as a light emission end face. The semiconductor layer includes a waveguide and a light window structure region. The waveguide has a first width and is extended between the end faces. The light window structure region includes an opening having a second width greater than the first width arranged along the waveguide and is formed continuously or intermittently from one to another of the end faces.
Public/Granted literature
- US20210066886A1 SEMICONDUCTOR LASER Public/Granted day:2021-03-04
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