Invention Grant
- Patent Title: Printed circuit board and display module comprising the same
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Application No.: US17124942Application Date: 2020-12-17
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Publication No.: US11246216B2Publication Date: 2022-02-08
- Inventor: Myeong Hui Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0026528 20200303
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11
Abstract:
The present disclosure relates to a printed circuit board including a first insulating layer; and a plurality of connection pads disposed on one surface of the first insulating layer, wherein the first insulating layer has a groove portion penetrating a portion of the first insulating layer in respective regions between the plurality of connection pads, and a display module including the same.
Public/Granted literature
- US20210282265A1 PRINTED CIRCUIT BOARD AND DISPLAY MODULE COMPRISING THE SAME Public/Granted day:2021-09-09
Information query
