Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.